MSquare

Chiplets Interconnection Blazing, Massive Computing Wellspring

Msquare Technology is a leading integrated circuit IP and Chiplet supplier in China, providing one-stop interface IP and high-speed interconnect solutions to meet growing demands for chip connectivity and computing power in the emerging industry landscape.

In high-speed interface IP, Msquare has independently developed a portfolio including HBM, UCIe, LPDDR, ONFI, PCIe, USB, PSRAM, eDP, SerDes, and MIPI, supporting process nodes from 55nm to 5nm. These solutions address memory-computing requirements across diverse fields such as artificial intelligence, data centers, and automotive electronics.

To tackle current challenges in chip interconnect and vertical application integration, Msquare has introduced Chiplet products based on interconnect IP, including M2LINK, D2D, and ML100 IO Die.

Msquare Technology is dedicated to building an open ecosystem platform for AI and Chiplet, aiming to provide comprehensive support for innovation and development in the integrated circuit and Chiplet industry.

Founded in Shanghai in 2021, the company employs over 80% R&D personnel and operates five global R&D centers, delivering comprehensive, reliable, and high-quality services to customers worldwide.


Vision

Join MSquare to make the best IP to contribute to the leapfrog of semiconductor industry!

Industry Vision
Industry Vision

In AI's stride, innovation thrives,
yet chip demand outstrips what supply contrives.

Company Vision
Company Vision

Breaking monopolies, forging open realms;
Empowering computing, industry standards helm.

Product Vision
Product Vision

Forging a global chip brand,

leading the interconnected chip frontier.

Providing comprehensive IP product suites,

chiplet solutions, and one-stop services for

the AI era's chip industry!

Company History

2021.08

MSquare Technology Incorporated

2021.09

Office in San Jose, U.S. Established

2021.11

Pre-A Financing Completed

2021.12

PSRAM PHY Delivered

2022.01

MSquare Joined MIPI Alliance

2022.02

PCIe 4.0 12nm Tapeout

2022.03

PSRAM PHY First Customer Tapeout

2022.04

MSquare Joined UCIe Alliance

2022.06

MSquare Joined USB-IF Association

2022.06

USB 3.2 12nm Tapeout

2022.08

MSquare Obtained ISO 9001 Certification

2022.10

ONFI 5.0 12nm

2022.12

Series A Financing Completed

2023.01

MSquare Joined CCITA Chiplet Working Group

2023.02

LPDDR4X 12nm Tapeout

2023.05

LPDDR5X 6nm Tapeout

2023.06

MSquare Open Day

2023.08

Office Sydney, Australia Established

2023.09

UCIe 12nm Tapeout

2023.10

ONFI 5.1 12nm Delivered

2023.10

LPDDR5X 6nm Delivered

2023.10

HBM3 12nm Delivered

2024.01

MSquare Obtained ISO26262: 2018 Certification

2024.06

CHhiplet IO Die Ready

2024.08

ONFI 5.1 5nm Delivered

2024.11

UCIe 6nm Tapeout

2024.12
ONFI 6.0 8nm Tapeout
2024.12

LPDDR5X 8nm Tapeout

2024.12
ONFI 5.1 5nm Verification completed
2025.02
ML 100 IO Die Delivered

Founding Team

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云浮分公司
南沙分公司