About Us - MSquare

MSquare

Chiplets Interconnection Blazing, Massive Computing Wellspring

MSquare Technology, incorporated in Shanghai in 2021, is a leading provider of integrated circuit IPs and Chiplets, dedicated to addressing the challenges of chip interconnectivity and vertical integration in the smart economy era.

Our portfolio of high-speed interface IPs, including HBM, LPDDR, ONFI, UCIe, eDP, PCIe, USB, as well as Chiplet solutions represented by M2LINK, are tailored for applications in AI, Data Centers, Automotive Electronics, the IoT, and Consumer Electronics.

MSquare strives to foster an open ecosystem service platform for AI and Chiplets, providing comprehensive support for innovation and development within the IC and Chiplet industry.

Vision

Join MSquare to make the best IP to contribute to the leapfrog of semiconductor industry!

Industry Vision

In AI's stride, innovation thrives,
yet chip demand outstrips what supply contrives.

Company Vision

Breaking monopolies, forging open realms;
Empowering computing, industry standards helm.

Product Vision

Forging a global chip brand,

leading the interconnected chip frontier.

Providing comprehensive IP product suites,

chiplet solutions, and one-stop services for

the AI era's chip industry!

Company History

2021.08

MSquare Headquarter in Shanghai Incorporated

2021.09

Office in San Jose, U.S. Established

2021.11

Pre-A Financing Completed

2021.12

PSRAM PHY Delivered

2022.01

MSquare Joined MIPI Alliance

2022.02

PCIe 4.0 12nm Tapeout

2022.03

PSRAM PHY First Customer Tapeout

2022.04

MSquare Joined UCIe Alliance

2022.06

MSquare Joined USB-IF Association

2022.06

USB 3.2 12nm Tapeout

2022.08

MSquare Obtained ISO 9001 Certification

2022.10

ONFI 5.0 12nm

2022.12

Series A Financing Completed

2023.01

MSquare Joined CCITA Chiplet Working Group

2023.02

LPDDR4X 12nm Tapeout

2023.05

LPDDR5X 6nm Tapeout

2023.06

MSquare Open Day

2023.08

Office Sydney, Australia Established

2023.09

UCIe 12nm Tapeout

2023.10

HBM3 Delivered

2024.01

MSquare Obtained ISO26262: 2018 Certification

2024.06

CHhiplet IO Die Ready

Founding Team

Wendy Chen

CEO / Founder

MBA, University of Manchester, UK.

VP, Alchip Asia Pacific.

Sales Director at Synopsys Technology.

Served as VP, TF-AMD.

23 years of experience in the IC industry.

Sean Wang

VP / Co-Founder

Master of Engineering, Royal Institute of Technology, Sweden.

Technical Expert of HiSilicon.

Chip architect of Haiguang, Imagination and Biren.

Founding team member of Nano Silicon Australia.

17 years of experience in IC industry.

Rui Tang

VP / Co-Founder

Ph.D. in Computer Engineering, Northeastern University, US

Chief Strategy Officer and General Manager of FuriosaAI Inc.

Investment Director of BOE Venture.

Staff Engineer, Apple Inc.

Principal Engineer, Oracle Corp.

23 years of experience in IC industry.

Fang Gong

VP / Co-Founder

Sales Director, Alchip Greater China.

Sales Director of Northern China, Tongfu Microelectronics.

19 years of technical and sales experience in IC industry.

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