On December 5th in Taipei, our ML100 IO Die was awarded the "Best IP/Processor of the Year" at the EE Awards Asia 2024! 

This milestone highlights the innovation behind the ML100 IO Die, which leverages advanced UCIe and HBM3 integration to drive breakthroughs in AI, cloud computing, and high-performance computing. 

Thank you to the EE Times | Electronic Engineering Times for this honor. We’re committed to shaping the future of design service! ML100 IO Die was awarded the "Best IP/Processor of the Year" at the EE Awards Asia 2024!