OVERVIEW

The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package. MSquare's M2LINK D2D Solution, which is compatible with the UCIe v1.0 specification, includes both a Die-to-Die adapter layer and a physical layer. Each layer features a sideband interface that provides a back-channel for link training and register access of the link partner, as shown in Figure 1. This Unique hybrid analog/digital architecture offers low power consumption, compact footprint, and robust performance, making it highly suitable for applications in high-performance computing, AI, multimedia SoCs, and Die-to-Die interconnections.

HIGHLIGHTS

Compatible with UCIe v1.0 specification

Single-ended, source synchronous and DDR IO Signaling

Supports 32 bits(16bits TX + 16bits RX) data bus per module for standard package

High clock frequency, up to 8GHz

16 Gbps/lane data rate

512Gbps (256Gbps TX + 256Gbps RX) bandwidth per module for standard package

High energy efficiency with ~0.8pJ/bit for standard package

Built in Test and diagnostics (Functional(PRBS), scan, at speed external loopback)

The advanced process of TSMC 12nm